The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2002
Filed:
Jan. 08, 2001
Kazushi Higashi, Neyagawa, JP;
Hiroyuki Otani, Ikoma, JP;
Shozo Minamitani, Ibaraki, JP;
Shinji Kanayama, Kashihara, JP;
Kenji Takahashi, Suita, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
Sealant is supplied in advance to one or both of the electrical bonding areas of the component and the mounting surface and as the component is brought in contact with the mounting surface the sealant is compressed and filled therebetween in a required area. At the same time ultrasonic vibration is applied to the component for generating friction between the electrical bonding areas of the component and the mounting surface in tight contact with each other, so that both electrical bonding areas are melted and ultrasonically bonded together, and thereby the component is mounted on the mounting surface