The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2002

Filed:

Mar. 26, 2001
Applicant:
Inventors:

Shinji Matsuda, Fujisawa, JP;

Tsutomu Hattori, Isehara, JP;

Masahito Katsukura, Fujisawa, JP;

Tadashi Minoda, Nagoya, JP;

Hideo Yoshida, Nagoya, JP;

Shinichi Matsuda, Nagoya, JP;

Mineo Asano, Toyoake, JP;

Tsutomu Furuyama, Nagoya, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C 2/108 ;
U.S. Cl.
CPC ...
C22C 2/108 ;
Abstract

An Al—Mg—Si—Cu aluminum alloy plate excelling in strength and formability and exhibiting improved filiform corrosion resistance which is suitably used for automotive body panels. The aluminum alloy plate contains 0.25-0.6% of Mg (mass %, hereinafter the same), 0.9-1.1% of Si, 0.6-1.0% of Cu, and at least one of 0.20% or less of Mn and 0.10% or less of Cr, with the balance consisting of Al and impurities, wherein the number of Q phases (Cu—Mg—Si—Al phases) with a size of 2 &mgr;m or more in diameter present in a matrix is 150 per mm or more. The aluminum alloy plate is fabricated by homogenizing an ingot of an aluminum alloy having the above composition at 530° C. or more, cooling the ingot to 450° C. or less at a cooling rate of 30° C./hour or less, hot-rolling the ingot, cold-rolling the hot-rolled product, and providing the cold-rolled product with a solution heat treatment.


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