Semiconductor package testing equipment including loader having package guider and method of loading a semiconductor package onto a test socket as aligned therewith

Abstract

A loader of semiconductor package burn-in test equipment allows a test socket to be commonly used for semiconductor packages of all sizes. The loader includes a vacuum suction head for picking semiconductor packages to be tested, and a package guider for ensuring that semiconductor packages of any size will be aligned with the test socket. As the semiconductor package is positioned over the test socket by the vacuum suction head of the loader, guide surfaces of the package guider are brought inwardly into guide positions at which the surfaces extend just beneath the vacuum suction head. Any semiconductor package that is not in alignment with the test socket while being held by the vacuum suction head is guided by the guides surfaces into alignment once the vacuum suction is turned off and the package falls from the vacuum suction head. Thus, the package guider serves as an adaptor, eliminating the need for several test sockets having respective adaptors for different sizes of semiconductor packages.