The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2002
Filed:
Jun. 14, 2000
Shuji Asai, Tokyo, JP;
NEC Corporation, , JP;
Abstract
A semiconductor element and a circuit thereof are formed on the front surface of a semiconductor substrate of a semiconductor device and are protected with an insulating film. An opening is bored that penetrates from the front surface to the back surface of the substrate at a predetermined position of the substrate. A buried wiring line of a metal film, which becomes a semiconductor substrate penetrative conductor, is formed on the inner surface of the opening. The space enclosed by the buried wiring line is filled with a resin film. A grounding pad or a terminal pad is disposed at a predetermined position on the back surface of the semiconductor substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile