The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2002
Filed:
Sep. 05, 2000
Applicant:
Inventor:
Champion Yi, Hsinchu, TW;
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 1/00 ;
U.S. Cl.
CPC ...
B24B 1/00 ;
Abstract
A method of polishing a wafer is disclosed. The wafer has formed thereon an oxide layer that has at least one via. A metal layer is formed on the oxide layer and in the via. The wafer is then polished against an outer portion of a polishing pad until the metal layer outside of the via has been removed. The outer portion has a first hardness. Next, the wafer is polished against an inner portion of the polishing pad. The inner portion of the polishing pad has a second hardness that is less than the first hardness.