The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2002
Filed:
May. 12, 1999
Samit S. Sengupta, San Jose, CA (US);
Koninklijke Philips Electronics N.V., Eindhoven, NL;
Abstract
A semiconductor device includes a substrate and a plurality of interconnect metallization lines defined over the substrate, each interconnect metallization line being provided with an electromigration-impeding composition including a percentage by weight of aluminum, a percentage by weight of copper, and a percentage by weight of zinc. The percentage by weight of zinc may be less than about 4 in solid solution in Al at 100 degrees C, which is a substantial increase in the Zn content over the about 0.5 weight percent of the Cu content in previously-used Al—Cu alloys. The percentage by weight of Zn may preferably range between about 1 and 2. The electromigration-impeding composition of the lines may include a structure of a solid solution of Al and Zn in the form of grains. The grains are bounded by grain boundaries. The structure further includes a precipitate of Al and Cu defined in the grain boundaries. Electromigration of the Al from the grain boundaries occurs and tends to cause the Al to electromigrate from the grains. The percentage by weight of Zn is selected to both define the solid solution with Al and to impede the electromigration of the Al from the grains. A method of making an interconnect metallization layer on a substrate includes depositing a metallization composition on the substrate, wherein the composition is the above-described composition.