The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2002
Filed:
May. 11, 2000
Kiyotaka Tsukada, Nagoya, JP;
Mitsuhiro Kondo, Ogaki, JP;
Naoto Ishida, Ogaki, JP;
Kouji Asano, Gifu-ken, JP;
Hisashi Minoura, Ogaki, JP;
Ibiden Co., Ltd., Ogaki, JP;
Abstract
A method for manufacturing a multilayer printed circuit board that shortens the distance between pattern layers and facilitates formation of a minute conductive hole having superior conductive reliability. A core substrate ( ) including ad core pattern ( ), which has a pad ( ), is first prepared. Then, a laminated plate is formed by laminating an insulating layer ( ) on the surface of the core substrate. Afterward, a surface pattern ( ) is formed on the surface of the laminated plate. Further, the conductive hole ( ) is formed by irradiating a laser beam at the laminated plate. The bottom opening of the conductive hole ( ) is covered by the pad ( ).