The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2002

Filed:

Jun. 30, 1999
Applicant:
Inventors:

Terrance J. Dishongh, Hillsboro, OR (US);

David H. Pullen, Portland, OR (US);

Gregory F. Taylor, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G08B 2/100 ;
U.S. Cl.
CPC ...
G08B 2/100 ;
Abstract

A circuit that senses changes in the electrical characteristics of one or more solder joints, and generates one or more signals based, at least in part, on the electrical characteristics that are sensed, is incorporated into an integrated circuit. In a further aspect of the present invention, the one or more signals generated by the circuit are indicative of the reliability of the solder joints. Embodiments of the present invention provide a warning in advance of system failure, permitting repair or replacement of a failing unit/joint before a failure becomes catastrophic. Embodiments of the present invention include structures and circuitry that can determine whether solder joint failure has occurred, and that can communicate the occurrence of solder joint failure to other components or systems.


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