The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2002

Filed:

Sep. 23, 1998
Applicant:
Inventors:

Dhrumil Gandhi, Cupertino, CA (US);

Lyndon C. Lim, San Jose, CA (US);

Assignee:

Artisan Components, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/358 ;
U.S. Cl.
CPC ...
H01L 2/358 ;
Abstract

Disclosed is a semiconductor standard cell architecture with local interconnect. The standard cell architecture includes a semiconductor substrate having diffusion regions that are designated for source and drain regions of a functional circuit. The standard cell also includes a polysilicon layer that is patterned to define gate electrodes and interconnections of the semiconductor standard cell architecture. In addition, the standard cell includes a local interconnect metallization layer that is patterned into a plurality of local interconnect metallization lines that are configured to be disposed over the semiconductor substrate and are further configured to substantially interconnect the source and drain regions and gate electrodes to define the functional circuit. The plurality of local interconnect metallization lines are further designed to incorporate local interconnect metallization pins that are connection points for interconnecting the functional circuit to another functional circuit. In a preferred embodiment, the local interconnect metallization lines are configured to be fabricated from a higher resistivity metal having a resistivity that is greater than aluminum containing metals.


Find Patent Forward Citations

Loading…