The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2002

Filed:

Nov. 27, 2001
Applicant:
Inventors:

Jao-Chin Cheng, Hsinchu, TW;

Chang-Chin Hsieh, Taipei, TW;

Bang-Chiung Liu, Taoyuan, TW;

Chung-Yuan Chiu, Taoyuan, TW;

Assignee:

Unimicron Technology Corp., Taoyuan Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract

A method of producing an external connector is provided. A substrate is provided and a plurality of pads are formed on the substrate. A copper layer is formed on the substrate to cover the pads. A patterned photoresist is formed on the copper layer. The patterned photoresist has a plurality of openings to expose the copper layer which corresponds to the pads. Then, a conductive plug is formed on the exposed copper layer. The patterned photoresist is removed, and the copper layer which is not covered by the conductive plug is subsequently removed. A solder resist is formed over the substrate to cover the pads and the conductive plug. A portion of the solder resist is removed until the conductive plug is exposed, wherein the solder resist is as high as the conductive plug.


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