The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2002

Filed:

May. 02, 2000
Applicant:
Inventors:

Mark S. Chang, Los Altos, CA (US);

Hao Fang, Cupertino, CA (US);

King Wai Kelwin Ko, San Jose, CA (US);

John Jianshi Wang, San Jose, CA (US);

Michael K. Templeton, Atherton, CA (US);

Lu You, Santa Clara, CA (US);

Angela T. Hui, Fremont, CA (US);

Assignee:

Advanced Micro Devices, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/976 ;
U.S. Cl.
CPC ...
H01L 2/976 ;
Abstract

A method and system for providing a plurality of contacts in a flash memory device is disclosed. The flash memory device includes a plurality of gate stacks and a plurality of field insulating regions adjacent to a portion of the plurality of gate stacks. The method and system include providing an etch stop layer covering the plurality of field insulating regions. The etch stop layer has an etch selectivity different from a field insulating region etch selectivity of the plurality of field insulating regions. The method and system also include providing an insulating layer covering the plurality of gate stacks, the plurality of field insulating regions and the etch stop layer. The method and system further include etching the insulating layer to provide a plurality of contact holes. The insulating layer etching step uses the etch stop layer to ensure that the insulating etching step does not etch through the plurality of field insulating regions. The method and system also include filling the plurality of contact holes with a conductor.


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