The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2002
Filed:
Jun. 02, 1998
Applicant:
Inventor:
Fumio Miyajima, Togura-machi, JP;
Assignee:
Apic Yamada Corporation, Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 3/318 ; B29C 3/368 ; B29C 4/502 ; B29C 4/514 ;
U.S. Cl.
CPC ...
B29C 3/318 ; B29C 3/368 ; B29C 4/502 ; B29C 4/514 ;
Abstract
A method of resin molding for molding regular products and a resin molding machine for the same. In the method of the present invention, release film, which is capable of easily peeling off from molding dies and resin, is provided on faces of molding dies. A member to be molded by the molding dies is clamped together with the release film. An inner face of a pot of the molding die is covered with the release film. A resin tablet is supplied into the pot.
Quick Actions:
Miyajima, Fumio. (2002). Method of resin molding (U.S. Patent No. 6444157). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6444157
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile