The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2002

Filed:

Oct. 17, 2000
Applicant:
Inventors:

John Caldwell, Meridian, ID (US);

James Nuxoll, Boise, ID (US);

Robert Totorica, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 3/102 ;
U.S. Cl.
CPC ...
G01R 3/102 ;
Abstract

A wafer cassette includes a stationary dual-zone temperature control base and a removable wafer cassette top. The top includes a main cassette support structure, onto which wafer test electronics, a test interface connector, a wafer interconnect assembly, a wafer test area, a flex film interconnect, and a wafer chuck with evacuation chamber and electric wafer heater, and at least one rough alignment fixture are mounted. A wafer to be tested is inserted, with a pressure-isolating seal, between the wafer chuck and the wafer test area. The base is a stationary fixed portion which includes a first support compartment, a second support compartment and thermal circuits, each of which includes fluid inlet and outlet connections. The fixed portion further includes a heater interconnect to provide connection and external access for a heater element, as well as a vacuum interconnect line to provide external connection to the evacuation chamber. The first and second support compartments are adjacently spaced, and each contains at least one of each of the thermal circuits.


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