The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2002

Filed:

Feb. 28, 2001
Applicant:
Inventors:

Shozo Minamitani, Ibaraki, JP;

Kazushi Higashi, Neyagawa, JP;

Kenji Takahashi, Suita, JP;

Shinji Kanayama, Kashihara, JP;

Hiroshi Wada, Osaka, JP;

Takafumi Tsujisawa, Toyonaka, JP;

Makoto Akita, Takatsuki, JP;

Kenji Okamoto, Hirakata, JP;

Shinzo Eguchi, Kyotanabe, JP;

Yasuhiro Kametani, Tosashimizu, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 1/06 ; B23K 5/20 ; B23K 2/010 ; G01N 2/904 ;
U.S. Cl.
CPC ...
B23K 1/06 ; B23K 5/20 ; B23K 2/010 ; G01N 2/904 ;
Abstract

When electrodes on an electronic component and electrode portions on a circuit board are joined via bumps with the electronic component and the circuit board vibrated respectively, a vibration damping detect device and a deciding device detect damping of the vibration caused by a progress of joining between the bumps and the electrode portions, and then determine a good or defective of the joining on a basis of the damping of the vibration. Further, regarding an impedance of an ultrasonic oscillator, a movement amount of a nozzle, or a current supplying to a VCM, these waveforms during the joining are compared with waveforms of good joining thereof and then the good or defective is determined. According to the above constructions, the good or defective of the joining between the electronic component and the circuit board can be determined during the joining. Further, when a joining state becomes wrong during the joining, the joining state can be changed. Thus generation of defective components is prevented and a yield can be improved.


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