The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2002
Filed:
Sep. 07, 2000
Anthony M. Chiu, Richardson, TX (US);
Tom Quoc Lao, Richardson, TX (US);
STMicroelectronics, Inc., Carrollton, TX (US);
Abstract
A heat sink is mounted on an integrated circuit die within a Chip Scale Package, without a substrate supporting the heat sink. The heat sink may be mounted on a central portion of the active surface of the integrated circuit die without impeding wire bond connection of bond pads around peripheral region of the active surface. Alternatively, the heat sink may be mounted on the backside of one integrated circuit die within a stacked configuration of integrated circuits having facing active surfaces. The required form factor for Chip Scale Packages is maintained while providing heat dissipation for high input/output devices. The heat sink may be wire bonded to a ground connection to provide the packaged integrated circuit with shielding from electrical or electromagnetic interference.