The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2002

Filed:

Oct. 13, 2000
Applicant:
Inventors:

Teiichirou Chiba, Kanagawa-ken, JP;

Ryusuke Komura, Kanagawa-ken, JP;

Akira Mori, Kanagawa-ken, JP;

Assignee:

Komatsu Limited, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/358 ;
U.S. Cl.
CPC ...
H01L 2/358 ;
Abstract

A dot mark having at its center a peaked portion rising from a face to be marked is provided on a cut face or ground face of a semiconductor wafer with the face to be marked having surface roughness of 0.3 &mgr;m or less. The rising dot mark is 1 to 15 &mgr;m in maximum length along the face to be marked and 0.01 to 5 &mgr;m in height. With even such a fine size, the dot mark is superior in visibility. This makes it possible to provide a semiconductor base material in which all processing histories in a process for manufacturing a semiconductor wafer and a semiconductor, wafer ID, chip ID, and manufacturing number or the like can be recognized.


Find Patent Forward Citations

Chiba, Teiichirou. (2002). Semiconductor base material having fine dot mark (U.S. Patent No. 6437454). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6437454

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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