The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2002
Filed:
Aug. 04, 2000
Applicant:
Inventors:
Nace Layadi, Singapore, SG;
Arun K. Nanda, Orlando, FL (US);
Assignee:
Agere Systems Guardian Corp., Orlando, FL (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/1302 ;
U.S. Cl.
CPC ...
H01L 2/1302 ;
Abstract
The present invention provides a method for polishing a semiconductor substrate comprising: (a) polishing a metal layer located on a semiconductor wafer with a slurry at a first polishing rate, wherein the slurry has a predetermined concentration of an oxidizing agent therein; (b) forming a diluted slurry by diluting the polishing slurry with a diluent to substantially reduce the predetermined concentration of the oxidizing agent; and (c) polishing the metal layer at a second polishing rate less than the first polishing rate and in the presence of the diluted slurry.