The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2002
Filed:
May. 24, 2001
Cheryl Hartfield, McKinney, TX (US);
Thomas M. Moore, Dallas, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A method for reworking integrated circuit (IC) wafers having copper-metallized bond pads covered by deposited layers of a barrier metal and a bondable metal. After identifying the wafers with off-spec metal layers, the wafers are chemically etched using selective etchants consecutively until the metal layers over the bond pads are removed without damaging the copper metallization. Replacement metal layers are finally deposited over the bond pads. Specifically, the bondable metal, such as gold, is selectively removed by a cyclic dithio-oxamine compound, dissolved in tetra-hydro-furane or acetone. The barrier metals, such as nickel and palladium, are removed by a mixture of inorganic and organic oxidizing acids.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile