The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2002

Filed:

Jun. 11, 2001
Applicant:
Inventors:

Hiroshi Hatada, Yokohama, JP;

Nobuaki Otsuka, Komae, JP;

Osamu Hirabayashi, Hiratsuka, JP;

Yasushi Kameda, Yokohama, JP;

Assignee:

Kabushiki Kaisha Toshiba, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A01L 2/358 ; A01L 2/348 ; A01L 2/352 ; A01L 2/940 ;
U.S. Cl.
CPC ...
A01L 2/358 ; A01L 2/348 ; A01L 2/352 ; A01L 2/940 ;
Abstract

A semiconductor device has pads that are arranged in such a manner as to easily accept manual needles to carry out a test. This technique is applicable to carry out a test with use of a boundary scan test circuit in synchronization with a cycle time defined by a normal operation clock signal. The semiconductor device has a first pad connected to a first one of registers that form a serial scan chain, to supply test data to the registers, a second pad connected to a last one of the registers, and a third pad to supply a test clock signal to the registers. The registers are arranged in a central part of the semiconductor device, and the first to third pads are arranged at the periphery of the semiconductor device.


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