Integrated circuit manufacture method with aqueous hydrogen fluoride and nitric acid oxide etch

Abstract

In the manufacture of an integrated circuit, contaminated oxide is replaced by relatively pure oxide using the following steps. First, a partially manufactured integrated circuit is bathed in an aqueous solution of hydrogen peroxide and ammonium hydroxide to oxidize organic materials and weaken bonds of metal contaminants to the integrated circuit substrate. Second, an aqueous rinse removes the oxidized organic materials and metal contaminants. Third, the integrated circuit is bathed in an aqueous solution of hydrogen fluoride and nitric acid. The hydrogen fluroide etches the contaminated oxide; the nitric acid combines with calcium and metal contaminants freed as the oxide is etched. The resulting nitride byproducts are highly soluble and easily removed in the following aqueous rinse. A drying step removes rinse water from the integrated circuit. Finally, an oxide formation step provides a relatively pure oxide layer. In the case of a gate oxide, the method removes a sacrificial oxide in preparation for gate oxide growth. In the case of formation of the submetal dielectric, oxide formation involves an TEOS oxide deposition. A key advantage of the invention is the improved calcium removal due to the nitric acid.