The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2002
Filed:
Jan. 19, 2001
King-Lung Wu, Tainan Hsien, TW;
United Microelectronics Corp., Hsin-Chu, TW;
Abstract
The present invention provides a method of automatically defining a landing via on a semiconductor wafer. The present invention involves first forming a conductive layer and a photoresist layer on the surface of the semiconductor wafer. Then, patterns of a plurality of word lines are defined on the surface of the photoresist layer, and patterns of a plurality of auxiliaries are defined around the area predetermined to form the landing via between each two word lines on the surface of the photoresist layer. Thereafter, the patterned photoresist layer is used as a hard mask to etch the conductive layer to form each word line on the semiconductor wafer, and to simultaneously form the auxiliaries around the area predetermined to form the landing via. Finally, a plurality of spacers are formed around each word line and each auxiliary dovetail together to form a landing via hole and to automatically define the position of the landing via.