The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2002
Filed:
May. 25, 1999
Sanjiv M. Bhatt, Minnetonka, MN (US);
Shawn D. Eggum, Victoria, MN (US);
Entegris, Inc., Chaska, MN (US);
Abstract
A wafer carrier is formed from at least two different melt processable plastic materials in which the two plastic materials are strategically positioned for optimal performance and have a thermophysical bond created during an overmolding process. The invention includes carriers made of such different melt processable plastic materials and includes the process for manufacturing such carriers. In a preferred embodiment a H-bar wafer carrier will have a first structural portion molded of polycarbonate in a first mold cavity and will then have the polycarbonate molded portion placed in a second mold cavity and polyetheretherketone will be injection molded to form wafer contact portions on the H-bar carrier. Process temperatures and mold temperatures are controlled to provide optimal bonding between the dissimilar materials. Thus, an integral wafer carrier of composite materials is formed. An additional embodiment utilizes components such as shelves or sidewall inserts for holding wafers molded of two dissimilar plastics and said components are assembled within a disk enclosure such as a transport module.