The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2002
Filed:
Aug. 21, 2000
Applicant:
Inventor:
Toshiaki Hongo, Shikishima-cho, JP;
Assignee:
Tokyo Electron Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C25B 9/00 ;
U.S. Cl.
CPC ...
C25B 9/00 ;
Abstract
This plating apparatus includes a plating bath filled up with a plating solution, a first O ring arranged on a top part of the plating bath , for electrical connection with an underlying electrode formed on a wafer , a second O ring arranged on the top part of the plating bath so as to prevent the plating solution in the plating bath from contact with the first O ring , an anode plate disposed in the plating bath and an ultrasonic oscillating element arranged in the plating bath . The plating apparatus is capable of forming a plating film having an uniform thickness on the semiconductor wafer.