Socket with embedded conductive structure and method of fabrication therefor

Abstract

A socket ( , FIG. ) includes a housing ( ) with multiple openings ( ) formed in the top surface. Each opening ( ) provides access to conductive contacts ( , FIG. ), which provide an electrical interface between a device that is inserted into the socket and the next level of interconnect (e.g., a PC board). Embedded within the socket is a conductive structure ( , FIG. ). In one embodiment, the conductive structure is electrically connected to one or more ground conducting contacts ( , FIG. ). The conductive structure includes column walls ( ), which run in parallel with columns of contacts, and row walls ( ), which run in parallel with rows of contacts and which intersect the column walls. In this manner, the conductive structure forms multiple chambers ( , FIG. ). Each signal carrying and power conducting contact is positioned within a chamber. Accordingly, the walls of the conductive structure function as a ground plane that surrounds the signal carrying and power conducting contacts.