The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2002
Filed:
Mar. 22, 2000
Gengying Gao, Fremont, CA (US);
Kevin Weaver, San Jose, CA (US);
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
A vibration resistant test module for use with semiconductor device test apparatus that includes a test module top plate, a test module bottom plate and a plurality of spring-and-wire assemblies. The test module top and bottom plates each have a plurality of openings extending between their upper and lower surfaces. Each of the spring-and-wire assemblies includes an electrically conducting wire with a top wire end and a bottom wire end, a top electrically conducting spring connector attached to the top wire end, and a bottom electrically conducting spring connector attached to the bottom wire end. The spring-and-wire assemblies are threaded through separate openings in the test module top and bottom plates such that the top electrically conducting spring connectors extend above the upper surface of the test module top plate, while the bottom electrically conducting spring connectors extend below the lower surface of the test module bottom plate. The top and bottom electrically conducting spring connectors are used to make secure and vibration resistant electrical connections between the vibration resistant test module and other semiconductor device test apparatus components.