The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2002
Filed:
Jan. 23, 2001
Applicant:
Inventors:
Bor Shiun Shih, Taichung, TW;
Yueh-Ying Tsai, Ching Shui Chen, TW;
Assignee:
Siliconware Precision Industries Co., Ltd., Taichung Hsien, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/3495 ; H01L 2/150 ;
U.S. Cl.
CPC ...
H01L 2/3495 ; H01L 2/150 ;
Abstract
A quad flat non-leaded package leadframe for supporting a die in a semiconductor package. The leadframe includes a plurality of packaging unit. Each packaging unit has a plurality of leads around a central region. Each pair of neighboring packaging unit is connected by a dam bar. The connected regions between the dam bar and the leads of each neighboring packaging unit have a thickness smaller than the other regions.