The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2002

Filed:

Sep. 08, 2000
Applicant:
Inventors:

Michel Marty, Varces, FR;

Herve Jaouen, Meylan, FR;

Assignee:

STMicroelectronics S.A., Gentilly, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/7108 ; H01L 2/976 ; H01L 2/994 ; H01L 3/1119 ;
U.S. Cl.
CPC ...
H01L 2/7108 ; H01L 2/976 ; H01L 2/994 ; H01L 3/1119 ;
Abstract

A process for fabricating a metal-metal capacitor within an integrated circuit comprises the steps of: producing a first metal electrode, a second metal electrode, and a dielectric layer on top of a lower insulating layer; and depositing an upper insulating layer on top of the two metal electrodes and the dielectric layer. The integrated circuit comprises the insulating layer, a first metal layer which is on top of the lower insulating layer, and the upper insulating layer which is on top of the first metal layer. The capacitor comprises the first metal electrode, the second metal electrode, and the dielectric layer wherein each of the two metal electrodes is in contact with one side of the dielectric layer. The electrodes and the dielectric layer lie between the lower insulating layer, which supports a level of metallization (M ), and the upper insulating layer which covers this level of metallization.


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