The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2002
Filed:
Apr. 08, 1999
Applicant:
Inventors:
Masahiro Wada, Omiya, JP;
Yoshitaka Mayuzumi, Omiya, JP;
Koji Hoshino, Omiya, JP;
Saburou Wakita, Omiya, JP;
Assignee:
Mitsubishi Materials Corporation, Omiya, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 3/24 ; B32B 3/26 ; B32B 7/04 ; H01M 4/80 ; B22F 7/02 ;
U.S. Cl.
CPC ...
B32B 3/24 ; B32B 3/26 ; B32B 7/04 ; H01M 4/80 ; B22F 7/02 ;
Abstract
A high strength spongy sintered metal composite sheet comprising a porous spongy sintered metal layer having continuous holes, and a high strength sintered, dense metal reinforcing layer having a porosity smaller than the porosity of the spongy sintered metal layer, laminated thereon, wherein the sintered, dense metal reinforcing layer has a thickness of 0.5-30% thickness with respect to the entire high strength spongy sintered metal composite sheet.