The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2002
Filed:
Aug. 11, 2000
Chi-Wei Chang, Hsin Chu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd, Hsin Chu, TW;
Abstract
A deformable fluid supply line for use on a semiconductor fabrication machine is described which includes a generally S-shaped expandable joint connecting between two straight conduit sections for providing full communication thereinbetween and for providing stress absorbing characteristics such that the expandable joint can be stretched or otherwise deformed by at least 2 cm without breaking connections with the two straight conduit sections. When the generally S-shaped expandable joint is provided with a length of at least 10 cm, a deformation of at least 3.5 cm can be tolerated by the expandable joint without causing failure or otherwise damages in the connections with the two straight conduit sections. The deformable fluid supply line can survive an earthquake of the magnitude of Richter 5 scale. The invention further discloses a method for connecting a deformable fluid supply line to a fabrication machine by using an S-shaped joint connected in between two straight conduit sections. The present invention novel deformable fluid supply line can survive various forms of deformations including stretching, compressing, twisting and bending.