The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2002
Filed:
Feb. 28, 2000
Applicant:
Inventors:
Roger W. Cheek, Essex Junction, VT (US);
George A. Dunbar, III, Essex Junction, VT (US);
Robert M. Geffken, Burlington, VT (US);
William J. Murphy, Essex Junction, VT (US);
Prabhat Tiwari, South Burlington, VT (US);
David H. Yao, Essex, VT (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; C23C 1/432 ;
U.S. Cl.
CPC ...
H01L 2/144 ; C23C 1/432 ;
Abstract
A method of forming a semiconductor device having aluminum lines therein, wherein the occurrence of lateral extrusions and voids are reduced. The method comprises the formation of a metal stack on a surface of the substrate, wherein the aluminum layer of the metal stack is deposited under controlled conditions; etching the metal lines in the metal stack; and exposing the substrate to a subsequent anneal.