The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2002

Filed:

Feb. 28, 2000
Applicant:
Inventors:

Oleg V. Kononchuk, Brush Prairie, WA (US);

Zbigniew J. Radzimski, Brush Prairie, WA (US);

Assignee:

SEH America, Inc., Vancouver, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 7/22 ;
U.S. Cl.
CPC ...
B24B 7/22 ;
Abstract

A process for demounting silicon wafers from a polishing plate is provided, wherein a polishing plate containing wafers is subjected to a fluid stream to separate the wafer from the polishing plate. The wafer then passes through a fluid stream to rinse the wafer. Finally, the wafer is placed in a cassette that is submerged in a dilute solution of hydroflouric acid and water, and waits in que for a standard cleaning process. By storing the wafer in the solution containing hydroflouric acid, metal precipitation on the surface of the wafer is prevented.


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