The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2002

Filed:

Oct. 05, 1999
Applicant:
Inventors:

Timothy W. Ellis, Doylestown, PA (US);

Nikhil Murdeshwar, Abington, PA (US);

Mark A. Eshelman, Lansdale, PA (US);

Christian Rheault, Willow Grove, PA (US);

Assignee:

Kulicke & Soffa Investments, Inc., Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/12 ; H01L 2/144 ;
U.S. Cl.
CPC ...
B05D 5/12 ; H01L 2/144 ;
Abstract

Methods for protecting the surface of an uninsulated portion of a copper circuit from environmental contamination detrimental to joining the surface to another metal surface, said method comprising the step of coating the surface with a layer of a ceramic material having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible when the surfaces are being joined to obtain metal-to-metal contact between the surfaces. Coated electronic packages including semiconductor wafers are also disclosed.


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