The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2002
Filed:
May. 03, 2000
Yukio Yamada, Tochigi, JP;
Sony Chemicals Corp., Tokyo, JP;
Abstract
A process for mounting a semiconductor device whereby electrodes of a fine-pitch semiconductor device and a wiring board can be surely connected to each other. A process for mounting a semiconductor by electrically connecting an electrode of an IC chip to an electrode of a wiring board by using an anisotropic conductive adhesive film having conductive particles dispersed in an insulating adhesive, which process involves: the step of tentatively thermocompression bonding an insulating adhesive layer free from conductive particle onto the wiring board and then forming a concave of a definite size in the insulating adhesive layer ; and the step of putting in the concave of the insulating adhesive layer an anisotropic conductive adhesive film and then putting an IC chip into the concave followed by positioning and thermocompression bonding.