The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2002
Filed:
Aug. 04, 1999
Fouriers Tseng, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin Chu, TW;
Abstract
An universal ball grid array (BGA) test board for performing a failure analysis on any size IC chips and a method for performing such analysis are disclosed. In the universal BGA test board, an electrically insulating material is used as a substrate with a rectangular opening provided at a center. A plurality of spaced-apart conductive lines are provided surrounding and adjacent to the center opening for use as ground and power supply respectively. A multiplicity of conductive leads, a multiplicity of ball pads are then provided on the surface of the substrate with a multiplicity of conductive traces connecting thereinbetween such that one conductive lead is connected to one ball pad. The test method can be easily conducted by first wire bonding the conductive leads to the bond pads on the IC chip and then contacting the ball pads with probe needles for feeding in test signals into the IC chip. Defects are shown as hot spots in a liquid crystal material that is coated on the top surface of the IC chip.