The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2002

Filed:

Feb. 25, 2000
Applicant:
Inventors:

Jennifer S. Obeng, Orlando, FL (US);

Yaw S. Obeng, Orlando, FL (US);

Assignee:

Agere Systems Guardian Corp., Orlando, FL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D 5/02 ; H05K 3/00 ;
U.S. Cl.
CPC ...
C25D 5/02 ; H05K 3/00 ;
Abstract

The present invention provides an aqueous electroplating solution. The aqueous electroplating solution includes a copper salt comprising a weight by weight percent of the electroplating solution between about 0.1% to about 2.5%. The electroplating solution also includes an inorganic acid having a dissociation constant of less than about 2.0, and comprising a weight by weight percent of the electroplating solution between about 0.1% to about 10%. The electroplating solution further includes a hydrogenated halide and a modulator, each that comprises a weight by weight percent of the electroplating solution between about 0.0001% to about 1%.


Find Patent Forward Citations

Obeng, Jennifer. (2002). Method of fabricating an integrated circuit (U.S. Patent No. 6406609). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6406609

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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