The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2002
Filed:
Oct. 13, 2000
Kosuke Inoue, Fujisawa, JP;
Asao Nishimura, Kokubunji, JP;
Takamichi Suzuki, Yokohama, JP;
Teru Fujii, Chigasaki, JP;
Masayuki Morishima, Yokohama, JP;
Yasuyuki Nakajima, Akishima, JP;
Noriyuki Oroku, Yokohama, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to form, there are various limitations to the material of which the bumps are made, to enough cubic volume of bumps and to small scattering of the bump height. According to the invention, solder balls and a tool having a large number of through-holes are used, and under the condition that the through-holes of the tool are aligned with the pads of the semiconductor device, the solder balls are charged into the through-holes, pressed to be fixed on the pads, and then reflowed to form bumps.