The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2002

Filed:

May. 10, 1999
Applicant:
Inventor:

Donald D. Baldwin, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/34 ; B23P 1/900 ;
U.S. Cl.
CPC ...
H05K 3/34 ; B23P 1/900 ;
Abstract

A system includes a printed circuit board (PCB) having multiple bonding sites and a packaged integrated circuit (IC) having multiple conductive portions for electrically contacting respective bonding sites when the IC is mounted thereon. A portion of the package is formed of a magnetic material. The system also includes a magnet to controllably induce a magnetic field at the PCB having a strength sufficient to attract the magnetic material provided in the IC package and to hold the packaged IC onto the PCB. The system also includes a testing unit for evaluating the PCB and packaged IC while the packaged IC is held onto the PCB by the magnetic field induced by the magnet. The IC package comprises a semiconductor IC chip encapsulated within a casing and a lead frame electrically coupled to the semiconductor IC chip. The lead frame includes the magnetic material.


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