The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2002

Filed:

Apr. 25, 2000
Applicant:
Inventors:

Kosuke Inoue, Yokohama, JP;

Tatsuya Yoneda, Kodaira, JP;

Takamichi Suzuki, Yokohama, JP;

Ryosuke Kimoto, Hamura, JP;

Junichi Suzuki, Ome, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/312 ;
U.S. Cl.
CPC ...
H01L 2/312 ;
Abstract

An aggregate of semiconductor devices, including semiconductor packages packaging the semiconductor devices, the packages being on a tape which is wound on a reel, is provided. The aggregate of semiconductor devices includes the semiconductor packages arranged consecutively on a first tape; and the aggregate also includes a second tape, which is a spacer tape, having spacers (protrusions), provided between adjacent windings of the first tape on the reel, providing spaces for the semiconductor packages. The semiconductor packages can be provided with bumps, e.g., on the side of the first tape opposite the side of the first tape having the semiconductor packages thereon, and the first tape can be a flexible printed circuit board.


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