The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2002
Filed:
Oct. 02, 2000
Applicant:
Inventor:
Masao Nakazawa, Nagano, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 5/00 ; H01B 1/00 ;
U.S. Cl.
CPC ...
C09D 5/00 ; H01B 1/00 ;
Abstract
A substitutional electroless gold plating solution for applying electroless gold plating to the surface of nickel. Tetraethylenepentamine as a straight chain alkylamine, hydrazine 1-hydrate as a reducing agent of nickel or a nickel alloy, and gold potassium cyanide as a gold source are blended into the electroless gold plating solution. It becomes possible to minimize the drop of shear strength of a solder member such as a solder ball resulting from a heat history even when a thin film-like gold plating layer is directly formed on the surface of nickel or a nickel alloy.