The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2002

Filed:

Dec. 30, 1999
Applicant:
Inventor:

Brad Bickford, Beaverton, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 1/366 ;
U.S. Cl.
CPC ...
H01R 1/366 ;
Abstract

A capacitive coupling includes a capacitive material and a conductor coupled to the capacitive material. The conductor and the capacitive material have a form factor to fixedly attach to either a connector housing or a chassis of an electronic device. The form factor of the conductor and the capacitive material is also to removably couple the connector housing and the chassis of the electronic device such that at least one signal frequency is passed between the connector housing and the chassis of the electronic device and a direct current is isolated between the connector housing and the chassis of the electronic device.


Find Patent Forward Citations

Bickford, Brad. (2002). Method and apparatus to reduce emi leakage through an isolated connector housing using capacitive coupling (U.S. Patent No. 6398588). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6398588

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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