The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2002
Filed:
Nov. 13, 2000
Kenji Yoshida, Tokyo, JP;
Takashi Naito, Tokyo, JP;
Shigeru Murayama, Tokyo, JP;
Katsuhiko Sakamoto, Kanagawa, JP;
Takashi Masaki, Kanagawa, JP;
Advantest Corporation, Tokyo, JP;
Abstract
A semiconductor component mounting apparatus for mounting a semiconductor component to test the electric characteristics of the semiconductor component, comprising: a contactor with which the semiconductor component contacts; a substrate which supplies an electric signal to the contactor ; a plurality of connection components , each of which has an electric terminal for supplying the electric signal to the substrate and which is fixed to the substrate ; a plurality of connectors which has a contact pin including a contact part for contacting with the electric terminal of the connection component , a housing for holding the contact pin , a pushing part for pushing the contact pin to the electric terminal , and which is freely-detachably connected to one of the plurality of the connection components ; a holder which holds the plurality of the connectors , and a fixing part which fixes the holder to the substrate , wherein the contact part slides along the electric terminal , while contacting with the electric terminal , when the pushing part pushes the contact pin