The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2002
Filed:
Jul. 27, 2000
Richard Alden DeFelice, Bernardsville, NJ (US);
Judith Prybyla, Edison, NJ (US);
Agere Systems Guardian Corp., Orlando, FL (US);
Abstract
A process for forming a semiconductor wafer with a flat surface is disclosed. In the process, a bare semiconductor wafer that has been sawed from an ingot is provided. A layer of planarization material is formed on at least one major surface of the semiconductor wafer. The layer of planarization material is placed into contact with a respective object having a flat surface. Pressure is applied to cause the planarization material to flow and impart a planar, surface to the layer of planarization material. The planarization material is then hardened. The flat surface is separated from contact with the respective layer of hardened material. The surface flatness is then transferred into the underlying substrate surface.