The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2002
Filed:
Jun. 12, 2000
Applicant:
Inventor:
Masakuni Shiozawa, Sakata, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
Abstract
A method of applying an adhesive material comprising the steps of: providing the adhesive material on an interconnect substrate; and pressure-bonding the adhesive material to the interconnect substrate. A base has a plurality of first regions to be punched out and second regions located between the first regions. An interconnect pattern is formed at least in the first regions. Part of the adhesive material located within the first regions is pressurized to flow toward the second regions to move air bubbles to the second regions.
Shiozawa, Masakuni. (2002). Adhesive material applying method and apparatus, interconnect substrate, semiconductor device and manufacturing method thereof, circuit board and electronic instrument (U.S. Patent No. 6391686). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6391686
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile