The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2002

Filed:

Feb. 17, 1998
Applicant:
Inventor:

Young Wook Heo, Kyungki-do, KR;

Assignee:

Amkor Technology, Inc., Chandler, AZ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/34 ;
U.S. Cl.
CPC ...
H05K 3/34 ;
Abstract

A method of fabricating a semiconductor package is provided, which realizes a small-size semiconductor package without performance deterioration, to meet a tendency to miniaturization of electronic products in which semiconductor packages are mounted, such as communication apparatus and computer, provides a new type of compact multi-pin semiconductor package as large as a semiconductor chip mounted thereon, and accomplishes a semiconductor package having multi-function to minimize its mounting area on an electronic product, resulting in minimizing of the products.


Find Patent Forward Citations

Heo, Young. (2002). Method of fabricating semiconductor package (U.S. Patent No. 6389689). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6389689

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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