The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2002

Filed:

Jun. 20, 2000
Applicant:
Inventors:

Toshiharu Seko, Yamabe-gun, JP;

Kenji Toyosawa, Ikoma, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/10 ;
U.S. Cl.
CPC ...
H05K 7/10 ;
Abstract

A semiconductor device comprising a patterned wiring including a connector for external connection formed on an elongate base film, a semiconductor element or the semiconductor element and a component other than the semiconductor element mounted on and electrically connected with a portion for connection of the patterned wiring, an elongate reinforcement member provided on a surface of the base film opposite to a surface on which the patterned wiring is formed, the reinforcement member having sprocket holes at positions corresponding to the lengthwise sides of the base film, wherein the reinforcement member is further provided on said opposite base film surface in a region corresponding with a region on which the connector for external connection is formed.


Find Patent Forward Citations

Seko, Toshiharu. (2002). Semiconductor device and process for manufacturing the same, liquid crystal module and process for mounting the same (U.S. Patent No. 6388888). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6388888

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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