The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2002
Filed:
Sep. 15, 1999
Vaiyapuri Venkateshwaran, Singapore, SG;
Ji Cheng Yang, Singapore, SG;
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A multichip semiconductor assembly comprising a semiconductor chip stack comprising first and second chips, each having an active surface including an integrated circuit and a plurality of input/output contact pads; a leadframe for interconnecting semiconductor integrated circuits having a plurality of leads, portions of said leads comprising undulating patterns and a surface metallurgy for promoting solder wetting, said leadframe being disposed between said first and second chips, and said active surface of said first chip positioned in front of said active surface of said second chip; and connections between each of said contact pads of said first chip to one of said leads, respectively, and between each of said contact pads of said second chip to one of said leads, respectively, said connections comprising solder balls, whereby the connections to at least one of said leads are common between said first and second chips.