The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2002
Filed:
Mar. 16, 1999
Kohei Toyama, Fukushima-ken, JP;
Shin-Etsu Handotai Co., Ltd., Tokyo, JP;
Abstract
A method and apparatus for lapping or polishing a semiconductor silicon single crystal wafer is provided for eliminating the transfer of waviness of a wafer cut by a wire saw apparatus, improving the quality of the wafer, realizing automated lapping or polishing processes, allowing for single crystal processing from a cassette to another cassette, and increasing the workability and labor productivity. A small amount “e” of single-side lapping or single-side polishing is repeated alternately on the two sides “A” and “B” of a semiconductor silicon single crystal wafer “W” to get to a predetermined total lapping or polishing stock removal.