The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2002
Filed:
Dec. 26, 2000
Tsutomu Mimata, Akiruno, JP;
Osamu Kakutani, Oume, JP;
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Abstract
A multi-chip bonding method and apparatus, in which a first wafer ring which has electronic components of a first type is held by a holding device; substrates are fed out to a conveying device from the first storing section; the electronic components of the first type on the holding device are successively bonded to the substrates; the substrates with the electronic components of the first type bonded is accommodated in the second storing section; the first wafer ring held by the holding device is exchanged for a second wafer ring which has electronic components of a second type; the substrates accommodated in the second storing section is fed out to the conveying device; the electronic components of the second type are successively bonded to the substrates; and the substrates with the electronic components of the second type bonded is accommodated in the first storing section.