The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2002
Filed:
Nov. 21, 2000
Syoichi Kobayashi, Nagano, JP;
Naoyuki Koizumi, Nagano, JP;
Osamu Uehara, Nagano, JP;
Hajime Iizuka, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano, JP;
Abstract
A method forwarding a semiconductor device that is excellent in bonding strength of bumps with respective protruded electrodes and having high reliability. A wiring pattern to be connected to an electrode of a semiconductor chip is formed on an insulting film formed on the semiconductor chip in which the electrode is formed. Protruded electrodes are formed on the wiring pattern . The wiring pattern is covered with a protective film , and a bump for external connection is formed on the end portion of each of the protruded electrodes exposed from the protective film . The bump is formed in such a manner that the bump is bonded to the at least entire end face of each of the protruded electrodes