The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2002

Filed:

Dec. 02, 1999
Applicant:
Inventors:

Teruo Ozaki, Yokohama, JP;

Ichiro Saito, Yokohama, JP;

Toshio Kashino, Chigasaki, JP;

Yoshiyuki Imanaka, Kawasaki, JP;

Masahiko Kubota, Tokyo, JP;

Muga Mochizuki, Yokohama, JP;

Yoshiaki Kurihara, Kawasaki, JP;

Masashi Miyagawa, Yokohama, JP;

Shuji Koyama, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B41J 2/05 ;
U.S. Cl.
CPC ...
B41J 2/05 ;
Abstract

There is provided a liquid discharge head provided with an element substrate and a ceiling plate fixed in a mutually opposed state, plural liquid path lateral walls provided between the ceiling plate and the element substrate and defining plural light flow paths, plural discharge energy generating elements arranged in parallel on the surface of the element substrate so as to be respectively positioned in the plural liquid paths, plural movable members in the form of a beam supported at an end, provided on the element substrate so as to be respectively opposed to the plural discharge energy generating elements and provided with fixed ends at the upstream side in the liquid flowing direction in the liquid paths and free ends at the downstream ends, and plural projections provided on the ceiling plate for respectively limiting the amount of displacement of the plural movable members, the element substrate and the ceiling plate being composed of similar materials, wherein the liquid path lateral walls are formed on the element substrate, and, on the ceiling plate, there is provided an engaging layer having recesses for fitting with the upper end faces of the liquid path lateral walls.


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